UniSCool
UniSCool Bind Industry 40 Acceleration Program Startup

Data centers account today for more than 5% of global electricity demand and, up to 40% of this consumption is due to its cooling systems.
UniSCool has patented a direct liquid cooling solucion, compact, that saves up to 70% of the electrical consuption and with high cooling performance (up to 300 W/cm2)

  • Project: Direct liquid cooling system for chips: energy efficiency in cooktop appliances

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404/05/2018

Bind 4.0’s startup Hupi opens office in the Basque Country

04/05/2018|

France’s Hupi, one of the startups that took part in Bind 4.0’s first edition, has opened an office in San Sebastian, in the Basque Country. It will be using its new base to capture industrial customers for its big data and artificial intelligence solutions. “The Bind 4.0 program triggered this [...]

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